Opposing target sputtering device
No damage to the substrate! A vacuum deposition device capable of ultra-low temperature sputtering.
We would like to introduce our "Opposing Target Sputtering Equipment." Argon plasma is confined between two opposing targets, and the confined argon plasma ejects target material onto a substrate positioned at a 90-degree angle to the targets. This allows for high-speed reactive sputtering, such as for oxide films. 【Features】 ■ No damage to the substrate: Ultra-low temperature sputtering is possible ■ Confined plasma: Low impedance even in high vacuum ■ Reactive gases (such as O2) are difficult to enter the plasma: Enables high-speed reactive sputtering for oxide films and more *For more details, please download the PDF or feel free to contact us.
- Company：ヤシマ
- Price：Other
